Apple is reportedly gearing up to switch the next generation of semiconductor technology, with plans to utilize TSMC’s 2nm process for its upcoming A20 and A20 Pro chipsets, slated for release in 2026. This move, according to industry sources, will be accompanied by a shift from TSMC’s InFo packaging to a new approach known as WMCM (Wafer-Level Multi-Chip Module).
2nm Apple A20 and A20 Pro Chipset: What We Know so Far!
The iPhone 17 series, expected to launch next year, will stick with TSMC’s 3nm node, albeit with the newer ‘N3P’ variant. However, the A20 and A20 Pro, destined for the iPhone 18 series, will be the first to feature the 2nm technology.
A recent post by AppleInsider suggests that the upcoming iPhone 18 series will feature an A20 chip manufactured using a 2-nanometer process with a novel packaging technology. The post further claims that all models will include 12GB of memory.
However, the transition to 2nm is being delayed for the iPhone 17 due to the high cost of wafers. However, the benefits of 2nm technology, including increased performance and reduced power consumption, make it a compelling choice for Apple’s flagship devices.
The adoption of WMCM packaging is another key aspect of Apple’s strategy. WMCM allows for the integration of multiple chips within a single package, enabling more complex chipsets with components like CPU, GPU, DRAM, and Neural Engine all working in unison. This approach offers greater flexibility in chip arrangement and performance scaling, potentially leading to even more powerful and efficient devices.
While the details are still shrouded in speculation, the potential implications of Apple’s 2nm and WMCM adoption are significant. The company could leverage these advancements to create even more powerful Mac chips, such as the M6 Ultra, further blurring the line between mobile and desktop computing.
As always, these rumors should be taken with a grain of salt. However, they paint a compelling picture of Apple’s future ambitions in the realm of chip design and development.
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