Snapdragon 7 Plus Gen 3 chipset to bring flagship power to mid-range phones, according to leak. Major performance boost expected.
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Learn about TSMC’s latest developments in semiconductor manufacturing, including its 2nm and 1.4nm process technologies.
Leak: MediaTek’s Dimensity 9400 beats Snapdragon 8 Gen 4. Tipster Digital Chat Station claims it is more powerful and capable.
TSMC’s 3nm Production to Reach 100,000 Wafers a Month by 2024. Qualcomm and Mediatek to join as costumers in 2024.
Qualcomm has unveiled its new Snapdragon 7 Gen 3 SoC, which promises to deliver better performance and efficiency than its predecessor.
Qualcomm’s Android feature for satellite SOS was supposed to enable users to send emergency messages without cellular coverage. However, the feature did not make it to the launch due to technical issues
Compare the graphics performance and efficiency of the Dimensity 9300, the Snapdragon 8 Gen 3, and the A17 Pro using the 3DMark Wild Life Extreme benchmark.
Qualcomm’s upcoming Snapdragon 8 Gen 4 chip is expected to outperform Apple’s M2 in graphics performance, according to a new rumor.
MediaTek is set to unveil two new flagship chipsets, the Dimensity 8300 and the Dimensity 9300, on November 6. Find out what features and performance they offer.
The Dimensity 9300 scored over 2 million points on the popular AnTuTu benchmark, surpassing the performance of its rivals, the Qualcomm Snapdragon 8 Gen 3