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Snapdragon 7 Plus Gen 3 chipset to bring flagship power to mid-range phones, according to leak. Major performance boost expected.
Learn about TSMC’s latest developments in semiconductor manufacturing, including its 2nm and 1.4nm process technologies.
Leak: MediaTek’s Dimensity 9400 beats Snapdragon 8 Gen 4. Tipster Digital Chat Station claims it is more powerful and capable.
TSMC’s 3nm Production to Reach 100,000 Wafers a Month by 2024. Qualcomm and Mediatek to join as costumers in 2024.
Qualcomm has unveiled its new Snapdragon 7 Gen 3 SoC, which promises to deliver better performance and efficiency than its predecessor.