Qualcomm officially launched the Snapdragon 8s Gen 4, offering top-tier performance and high-end features at a low cost. According to the company, the chip delivers up to a 49% performance improvement compared to the previous generation. Despite its premium features, it lacks the powerhouse Oryon cores and instead uses a Kryo CPU architecture.

Snapdragon 8s Gen 4 Details
The chip uses TSMC’s older 4nm lithography (N4P node) with a 1+3+2+2 configuration. The prime core (Cortex X4) is clocked at 3.20 GHz, the performance cores (Cortex-A720) are clocked at 3.00 GHz and 2.80 GHz, and the efficiency cores (Cortex-A720) are clocked at 2.02 GHz.
The Adreno 825 GPU offers a 49% graphics performance improvement over the Snapdragon 8s Gen 3, which is positioned lower than the SD 8 Elite.

For AI capabilities, it offers up to a 44% improvement in on-device AI performance, supporting image recognition, voice commands, and real-time translation. Camera features include support for up to a 320MP single sensor, 8K HDR video playback at 60 FPS, 4K HDR video capture at 60 FPS, and 4K 120 FPS slow-motion video.
Display support includes up to 4K 60 FPS HDR10+ displays, 10-bit color depth, 5-axis video stabilization, and Qualcomm’s Secure Management Engine for enhanced security.
A drawback is the lack of mmWave band support. However, the company added a top-tier 5G modem—a sub-6GHz baseband chip—that can reach maximum downlink speeds of 4.2 Gbps. Other features include Bluetooth 6.0, LPDDR5X RAM, UFS 4.0, and Wi-Fi 7.
Snapdragon 8s Gen 4 Specifications | |
---|---|
CPU Name | Qualcomm® Kryo™ Architecture: 64-bit Clock Speed: 3.2Ghz |
GPU Name | Adreno 825 APIs: OpenGL® ES 3.2, Vulkan® 1.3, OpenCL™ 2.0 FP |
Qualcomm® Hexagon™ Processor Features | Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Tensor Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Dedicated power delivery system, Micro Tile Inferencing, Hexagon Direct Link, Large shared AI memory, Fused AI Accelerator architecture |
Qualcomm® Sensing Hub Features | Dual-core AI processor, Always-sensing camera |
Modem Name | Snapdragon® 5G Modem-RF System |
Peak Download Speed | 4.2 Gbps |
Cellular Modem-RF Specs | 4×4 MIMO (Sub-6) |
Performance Enhancement Technologies | Qualcomm® Wideband Envelope Tracking, Qualcomm® 5G Ultra-Low Latency Suite, Qualcomm® 5G AI Suite, Qualcomm® 5G PowerSave Gen 3, Qualcomm® Smart Transmit™ Gen 5 technology |
Cellular Technology | 5G NR, HSPA, sub-6 GHz, TDD, LTE, WCDMA, FDD, SA (standalone), NSA (non-standalone), CDMA 1x, EV-DO, GSM/EDGE, EN-DC, CBRS |
SIM | Dual SIM Dual Active (DSDA) 5G+5G and 5G+4G |
Wi-Fi/Bluetooth System | Qualcomm® FastConnect™ Mobile Connectivity System |
Generation | Wi-Fi 4, Wi-Fi 5, Wi-Fi 6, Wi-Fi 7 |
Standard | 802.11b, 802.11g, 802.11n, 802.11ac, 802.11a, 802.11ax, 802.11be |
Bluetooth | Bluetooth® 6.0 |
Location | QZSS, Galileo, Beidou, GLONASS, NavIC, GPS, GNSS |
NFC | support |
Camera | up to 320 MP |
Video recording | 4K @ 60 fps, 1080p @ 480 fps slow-motion Dolby Vision®, Hybrid Log Gamma (HLG), HDR10, HDR10+ |
Video Playback | 8K @ 60 fps |
RAM | LPDDR5X |
ROM | UFS 4.0 |
Display | WQHD+ 144Hz, QHD+ @ 144 Hz Dolby Vision®, HDR10, HDR10+, HDR Vivid |
Audio | Qualcomm Aqstic™ smart speaker amplifier, Qualcomm Aqstic™ audio codec Qualcomm® aptX™ Adaptive, Qualcomm® aptX™ Voice, Qualcomm® aptX™ Lossless Snapdragon Sound™ technology, Spatial Audio |
Charging | Qualcomm® Quick Charge™ 5 technology |
Security | Qualcomm® 3D Sonic Sensor Max |
USB | USB Type-C, USB 3.1 Gen2 |
Model | Snapdragon 8s Gen 4 (SM8735) |
Source: Qualcomm
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