According to recent reports, Taiwan Semiconductor Manufacturing Company (TSMC) is set to significantly increase its 3nm wafer production capacity by the end of 2024. Currently, TSMC’s 3nm capacity is reaching between 60,000-70,000 wafers per month. However, it is expected to witness a substantial jump, reaching 100,000 wafers per month by the end of 2024.
TSMC’s 3nm process node, known as N3B, is currently being utilized by one major customer, Apple. The iPhone 15 Pro and iPhone 15 Pro Max are powered by the A17 Pro, the only 3nm application processor found on a smartphone this year. Apple has reserved most of TSMC’s 3nm production due to the high cost of wafer prices, which are $20,000 per wafer, and the yields being around 55%.
Qualcomm and Mediatek
In addition to Apple, Qualcomm and MediaTek are expected to join as customers for TSMC’s second-generation 3nm node, N3E, in 2024. The increase in production is anticipated to meet the rising demand for 3nm chips from these companies. The Snapdragon 8 Gen 4 and the Dimensity 9400 application processors are among the chips expected to be produced using the N3E node.
It is projected that TSMC’s 3nm production could account for 10% of its revenue in 2024, double the 5% it accounted for this year. This signifies the growing importance of the 3nm process in TSMC’s business.
Read more: News
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