The Unisoc T8300 5G SOC crafted from TSMC’s 6nm EUV process, featuring Cortex-A78 core clocked at 2.2GHz and six Cortex-A55 efficiency cores clocked at 2.0GHz.
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Mediatek has launched two new Dimensity 7400 series chips for the midrange lineup: the Dimensity 7400 and Dimensity 7400X.
MediaTek has quietly unveiled the Dimensity 6400, a chip representing a modest yet meaningful improvement over its predecessor.
Qualcomm is reportedly launching its next-generation Snapdragon X2 series this year to compete with Apple, Intel, and AMD.
According to leaks from reliable leaker Erencan Yılmaz on X, the Qualcomm Snapdragon 8 Elite Gen 2 (SM8850) is currently being tested on HyperOS 2.
The MediaTek Dimensity 8350 is an incremental upgrade over its predecessor, the Dimensity 8300, primarily focusing on enhancing gaming performance.
The next Tensor G5 will release in 2025 and it is scheduled to be fabricated on TSMC’s second-generation 3nm process.
Snapdragon 8 Elite full linux support opening up new possibilities for PC games and emulation on mobile devices.
Apple is reportedly switch to TSMC’s 2nm process for its upcoming A20 and A20 Pro chipsets, slated for release in 2026.
The MediaTek Dimensity 8400 MT6899 has been confirmed to exist, appearing in both HyperOS and on MediaTek’s product security bulletin.