MANILA, Philippines – MediaTek has launched its Dimensity 8500 mobile processor, introducing a new tier of performance alongside the sub-flagship Dimensity 9500s. Manufactured on Taiwan Semiconductor Manufacturing Company’s (TSMC) 4nm node, the chip features an All Big Core CPU architecture, expanded in-chip caches, and industry-leading memory speeds, balancing high performance with power efficiency.
The Dimensity 8500 made its debut in the Honor Power 2, which launched in China on January 5, 2026. Benchmark testing on the device confirms the processor can achieve scores of up to 2.4 million points on Antutu, a widely used mobile performance assessment tool.
Features, Specifications, and and Performance
The chip’s CPU is configured with eight Arm Cortex-A725 cores across three clusters:
- One core operating at up to 3.4GHz with 1MB of L2 cache
- Three cores running at up to 3.2GHz with 512KB of L2 cache per core
- Four cores clocked at up to 2.2GHz with 256KB of L2 cache per core
Additional cache includes 6MB of L3 and 5MB of system-level cache (SLC). The processor supports LPDDR5X memory at 9600Mbps, representing a 12% increase in speed compared to prior generations.
Graphics and AI Capabilities
For graphics processing, the Dimensity 8500 integrates the Arm Mali-G720 MC8 GPU, paired with MediaTek’s HyperEngine technology for optimized performance in multimedia and gaming applications.
The chip’s artificial intelligence processing unit (AI PU) is the MediaTek NPU 880, which includes support for Diffusion Transformer models, NeuroPilot compression technology, mixed-precision INT4 quantization, and speculative decoding to accelerate inference for large language models (LLMs).
Display and Memory Specifications
The processor supports WQHD+ resolution displays with refresh rates up to 144Hz, and enables dual-screen functionality via dual Display Serial Interface (DSI) connections. It is compatible with LPDDR5X memory and UFS 4 storage with Multi-Core Queue (MCQ) technology.
Connectivity Features
Connectivity capabilities include Wi-Fi 6E (supporting 802.11a/b/g/n/ac/ax standards) and Bluetooth 5.4. For 5G networks, the chip offers up to 3-component carrier aggregation (3CC-CA), downlink speeds of up to 5.17 Gbps, MediaTek UltraSave 3.0+ power management, and 2nd Generation Dual SIM Dual Active (DSDA 2.0) technology.
Camera Support
The Dimensity 8500 can drive camera sensors up to 320 megapixels, handle three simultaneous 32-megapixel streams at 30 frames per second (FPS), and capture 4K video at 60FPS (3840 x 2160 resolution).
Source: via Mediatek
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