Mediatek recently unveiled their new midrange chipset, the Mediatek Dimensity 7300 and Dimensity 7300X. According to their post on their official account on (X) former Twitter, this is made from a 4nm TSMC node with ultra-efficiency chip and AI-enhanced computing unit. The chipset is also listed on their official website where the full details of this new Mediatek chipset can be seen.
Mediatek Dimensity 7300 and Dimensity 7300X Features
According to Mediatek, both chipset have an octa-core CPU configuration. These chipsets boast a powerful setup, featuring 4X Arm Cortex-A78 cores clocked at speeds of up to 2.5GHz, paired with 4X Arm Cortex-A55 cores. The use of a cutting-edge 4nm process in the A78 cores results in a significant 25% reduction in power consumption compared to the previous Dimensity 7050 model.
In addition to the impressive CPU setup, the Dimensity 7300 series incorporates the latest Arm Mali-G615 GPU and a range of MediaTek HyperEngine optimizations, aimed at enhancing gaming performance. Compared to rival offerings, these chipsets deliver a notable 20% increase in FPS speed and a 20% improvement in energy efficiency, setting them apart in the competitive market.
Furthermore, MediaTek has focused on optimizing the gaming experience by implementing smart resource management, refining 5G and Wi-Fi connectivity for gaming, and supporting Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio. These advancements aim to elevate the gaming experience for users, making the Dimensity 7300 chipsets a compelling choice for tech enthusiasts and gamers alike.
According to Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business, emphasized the significance of the MediaTek Dimensity 7300 chips in advancing AI capabilities and connectivity features for consumers. According to Dr. Lee, these chips play a crucial role in enabling smooth streaming and gaming experiences for users. Additionally, he highlighted the innovative potential of the Dimensity 7300X variant, which offers support for dual displays, empowering OEMs to explore creative new form factors in their devices. The remarks by Dr. Lee underscore the strategic importance of the Dimensity 7300 series in driving technological innovation and user experiences in the tech market.
The MediaTek Dimensity 7300 chipsets introduce enhanced photography capabilities through the integration of the MediaTek Imagiq 950 technology. This cutting-edge feature includes a high-quality 12-bit HDR-ISP with compatibility for a 200MP primary camera. Equipped with advanced hardware engines for precise noise reduction (MCNR), face detection (HWFD), and video HDR, the Dimensity 7300 empowers users to capture exceptional images and videos under varying lighting conditions. Notably, the chipset offers improved live focus photo performance, which is 1.3 times faster, and photo remastering, which is 1.5 times faster than its predecessor, the Dimensity 7050. Users can also enjoy recording 4K HDR videos with a dynamic range over 50% wider than competing solutions, resulting in enhanced video details.
Furthermore, the MediaTek APU 655 integrated into the Dimensity 7300 chips significantly enhances AI task efficiency, delivering double the performance compared to the Dimensity 7050. These chips also support new mixed precision data types, optimizing memory bandwidth usage and reducing memory requirements for larger AI models.
The inclusion of MediaTek’s MiraVision 955 in the Dimensity 7300 SoCs enables support for detailed WFHD+ displays with 10-bit true color and compliance with global HDR standards, enriching the media streaming and playback experience. Moreover, the dedicated provision for dual display flip phones in the Dimensity 7300X variant simplifies the task for OEMs to cater to the increasing market demand for innovative form factors, showcasing MediaTek’s commitment to driving technological advancements in the mobile industry.
Mediatek Dimensity 7300 and Dimensity 7300X Key Specifications
- CPU: 4X 2.5GHz Arm Cortex A78, 4X Arm Cortex A55
- Arm Mali G615 MC2 GPU
- LPDDR5 RAM support
- UFS 3.1 storage support
- WiFi 6E
- Bluetooth version 5.4
- MediaTek 6th Gen APU 655
- Display WFHD+ 120Hz
- FHD+ 144Hz
- 200MP camera support
- 4K 30FPS video support
- MediaTek Imagiq 950
- MediaTek MiraVision 955
- 12-bit HDR-ISP
- MediaTek 5G UltraSave 3.0+
What is the difference of Mediatek Dimensity 7300 and Mediatek Dimensity 7300X?
The MediaTek Dimensity 7300 and MediaTek Dimensity 7300X are both 5G chipsets with similar core specifications, including an octa-core CPU configuration with 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores. However, the key difference lies in their additional features and capabilities.
The MediaTek Dimensity 7300X variant is specifically designed to support innovative form factors, particularly dual display flip phones. This variant enables original equipment manufacturers (OEMs) to explore new design possibilities and cater to the growing market demand for devices with dual displays. In contrast, the MediaTek Dimensity 7300 focuses on providing enhanced AI capabilities, connectivity features, and gaming experiences for mid-range smartphones. Both chipsets offer advancements in power efficiency, performance, and multimedia capabilities, but the Dimensity 7300X stands out for its unique support for dual display flip phones, showcasing MediaTek’s commitment to facilitating diverse and innovative device designs in the mobile industry.
Also Read: Mediatek and Microsoft Colab
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