MediaTek to Announce Dual Dimensity Chipsets on January 15

MediaTek has confirmed it will unveil two new Dimensity chipsets on January 15 at 3:00 p.m. local time, according to a post shared by the company on Weibo. The event will take place at 12:30 p.m. IST. While MediaTek did not specify the exact models in its announcement, multiple tipsters on Weibo have indicated that the company is set to introduce the Dimensity 9500s and the Dimensity 8500.

According to information circulating on Weibo, the Dimensity 9500s is expected to be manufactured using TSMC’s N3E process. The chipset is reported to feature a CPU configuration consisting of one Cortex-X925 core clocked at 3.73GHz, three Cortex-X4 performance cores running at 3.30GHz, and four Cortex-A720 efficiency cores operating at 2.40GHz. Graphics processing is said to be handled by a Mali Immortalis-G925 MC12 GPU with a reported frequency of 1612MHz.

Tipster Digital Chat Station has indicated that the Dimensity 9500s is expected to be used in the Redmi Turbo 5 Max. The same source also mentioned that the device may support 100W fast charging.

The second chipset, the Dimensity 8500, is reported to feature a Mali-G720 MC8 GPU and to be manufactured using TSMC’s 4nm process. The first smartphone confirmed to use the Dimensity 8500 is the Honor Power 2, which debuted in China on January 5. The chipset is said to include an octa-core CPU layout with one Cortex-A725 performance core clocked at 3.40GHz, three Cortex-A725 mid cores running at 3.20GHz, and four Cortex-A725 efficiency cores operating at 2.20GHz.

Benchmark results shared in relation to the Honor Power 2 indicate an AnTuTu score of 2,407,614. These figures place the device above scores reported for smartphones powered by the Snapdragon 8 Gen 3 and Snapdragon 8s Gen 4, based on the cited results.

MediaTek has not yet released official specifications for either chipset. Further details are expected to be confirmed during the company’s January 15 announcement.