MediaTek has unveiled the Dimensity 7100, a new 6nm 5G chipset designed for midrange smartphones. It features a configuration of four Arm Cortex-A78 cores clocked at 2.4GHz and four Arm Cortex-A55 cores at 2.0GHz, paired with an Arm Mali-G610 MC2 GPU.
The chip is an upgrade to the Dimensity 7050 and is expected to power affordable 5G devices launching in 2026. Rumor has it the Tecno Pova Curve 2 will be one of the first phones to pack the Dimensity 7100. Just recently, its design and specs leaked online, and that includes the chipset too.
According to MediaTek, the Dimensity 7100 incorporates a power-efficient design, with overall smartphone enhancements delivering 5% to 16% better energy efficiency than its predecessor.
Power efficiency upgrades include:
- Up to 5% more power-efficient performance in apps
- Up to 23% more power-efficient modem
- Up to 16% more power-efficient multimedia playback
For displays, the chipset supports FHD+ resolution with 10-bit color depth, HDR10+, and refresh rates up to 120Hz. Additional features include support for 200MP image sensors, LPDDR5 RAM, UFS 3.1 storage, Wi-Fi 6, and Bluetooth 5.4.
Specifications | |
|---|---|
| CPU | 4x Arm Cortex-A78 @2.4GHz 4x Arm Cortex-A55 @2.0GHz |
| GPU | Arm Mali-G610 MC2 (+8% vs 7050) |
| Memory | LPDDR5 @ 5500 Mbps LPDDR4x @ 4266 Mbps |
| Storage | UFS 3.1 |
| Max Camera ISP | 200MP |
| Max Display Resolution | FHD+ 1200 x 2600 |
| Refreshrate | up to 120Hz |
| WIFI | WIFI 6 (a/b/g/n/ac/ax) |
| Bluetooth | 5.4 |
| Charging Speed Support | up to 45W |
| Camera Support | up to 200MP (4K resolution) |
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