MediaTek has officially announced the Dimensity 9400, its latest flagship smartphone chipset designed to power the next generation of mobile experiences. This powerful chip boasts significant upgrades over its predecessor, the Dimensity 9300, in terms of AI, CPU, and GPU performance, promising a smoother, more immersive, and energy-efficient experience for users.
A Chip Built for Performance and Efficiency
The Dimensity 9400 is built on TSMC’s second-generation 3nm process, known as N3E, making it one of the first consumer-market chips to leverage this advanced technology. This manufacturing process results in a 40% improvement in power efficiency compared to its predecessor, enabling longer battery life for users.
The chip’s CPU architecture features an all-big-core design, consisting of one Arm Cortex-X925 core clocked at 3.62GHz, three Cortex-X4 cores, and four Cortex-A720 cores. This configuration delivers a 35% boost in single-core performance and a 28% improvement in multi-core performance compared to the Dimensity 9300.
Immersive Gaming with Ray Tracing and OMM Support
The Dimensity 9400 features a 12-core Arm Immortalis-G925 GPU, which delivers a 41% increase in peak performance and a 40% boost in ray tracing capabilities compared to the previous generation. The GPU also supports Opacity Micro Maps (OMM), a technology that enhances the perceived depth in scenes with nuanced layering effects by reducing geometry rendering and adding visual details without increasing model complexity. This feature allows for more realistic effects in mass-materials like vegetation, hair, and feathers, bringing a new level of realism to mobile gaming.
AI-Powered Photography and Video
The Dimensity 9400 integrates MediaTek’s 8th generation NPU, which supports Agentic AI and offers a 100% faster diffusion generation performance and an 80% faster LLM prompt performance compared to the Dimensity 9300. This powerful AI engine also enables on-device LoRA training, allowing for the development of more sophisticated AI applications directly on the device.
The chip also features MediaTek Imagiq 1090, which enables HDR video capture throughout the entire zoom range, resembling a professional camera zoom lens. This ensures that there’s never a drop in quality, even when zooming in on distant subjects. The Dimensity 9400 also supports up to 320MP cameras and 8K video recording at 60fps.
Advanced Connectivity and Features
The Dimensity 9400 incorporates a 3GPP Release-17 5G modem that supports 4CC-CA and delivers up to 7Gbps sub-6GHz performance. The chip also features a new 4nm Wi-Fi 7/Bluetooth combo chip that is 50% more power-efficient for both Wi-Fi and Bluetooth connectivity.
The Dimensity 9400 also supports LPDDR5X RAM, UFS 4.0 storage, and MiraVision 1090. The display supports WQHD+ resolution and up to 180Hz refresh rate, ensuring a smooth and responsive user experience. The chip also supports 5G/4G Dual SIM Dual Active and Dual Data, providing users with greater flexibility in managing their connections.
The first smartphones powered by the MediaTek Dimensity 9400 are expected to be available in the market starting in Q4 of 2024. The Vivo X200 series will be the first to feature this powerful chipset.
| Mediatek Dimensity 9400 Full Specifications | |
|---|---|
| CPU: 1x Arm Cortex-X925, 2MB L2 cache, up to 3.63 GHz 3x Arm Cortex-X4, 1MB L2 cache 4x Arm Cortex-A720, 512KB L2 cache 12MB L3 cache 10MB SLC | Camera: Max Camera Sensor Supported 320MP Max Video Capture Resolution 8K60 (7690 x 4320) |
| GPU: Arm Immortalis-G925 MC12 | Display: Max Refresh Rate WQHD+ 180Hz Tri-port MIPI for Tri-Fold Displays |
| Memory: Memory Types LPDDR5X Max Memory Frequency 10667 Mbps Storage Type UFS 4 + MCQ | AI: AI Processing Unit MediaTek NPU 890 (Generative AI, Agentic AI) |
| Connectivity: Cellular Technologies 3GPP-R17, Sub-6GHz (FR1), 2G-5G multi-mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM Specific Functions 5G/4G Dual SIM Dual Active, Dual Data, SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR FR1 TDD+FDD, DSS, 256QAM VoNR / EPS fallback DL Functions Sub6 DL 4CC 300MHz, R17 Enhancement, LB DL 4×4 MIMO UL Functions Sub6 UL 2CC 200MHz, R17 Enhancement, FDD UL 2x2MIMO/PC2 Power Savings MediaTek UltraSave 4.0, R17 Power Saving Enhancement GNSS • GPS L1CA+L5+L1C • BeiDou B1I+ B1C + B2a +B2b • Glonass L1OF • Galileo E1 + E5a + E5b • QZSS L1CA + L5 • NavIC L5 Wi-Fi Wi-Fi 7 (a/b/g/n/ac/ax/be) Wi-Fi Antenna Triple Band Triple Concurrency (TBTC) Wi-Fi Peak Data Rate 7.3Gbps Bluetooth 5.4 with dual Bluetooth engine Bluetooth Peak Data Rate 12Mbps | |
Source: Mediatek
The Dimensity 9400 represents a significant upgrade from its predecessor. With its focus on AI, gaming, and photography, the chip promises to deliver a more immersive, powerful, and efficient mobile experience for users. As the adoption of advanced AI technologies continues to grow, the Dimensity 9400 is expected to compete with Snapdragon, Samsung Exynos, and even Apple’s A18 Pro on the market.
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